- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/053 - Containers; Seals characterised by the shape the container being a hollow construction and having an insulating base as a mounting for the semiconductor body
Patent holdings for IPC class H01L 23/053
Total number of patents in this class: 733
10-year publication summary
|
50
|
77
|
68
|
85
|
65
|
54
|
50
|
65
|
63
|
22
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Mitsubishi Electric Corporation | 43934 |
79 |
| Fuji Electric Co., Ltd. | 4750 |
55 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
51 |
| Infineon Technologies AG | 8189 |
45 |
| Samsung Electronics Co., Ltd. | 131630 |
28 |
| Micron Technology, Inc. | 24960 |
16 |
| Intel Corporation | 45621 |
15 |
| Kyocera Corporation | 12735 |
15 |
| Advanced Semiconductor Engineering, Inc. | 1546 |
14 |
| International Business Machines Corporation | 60644 |
13 |
| Texas Instruments Incorporated | 19376 |
13 |
| Semiconductor Components Industries, L.L.C. | 5345 |
13 |
| Renesas Electronics Corporation | 6305 |
12 |
| Apple Inc. | 50209 |
9 |
| Shinko Electric Industries Co., Ltd. | 1186 |
8 |
| Analog Devices, Inc. | 3475 |
7 |
| Robert Bosch GmbH | 40953 |
6 |
| Mediatek Inc. | 4584 |
6 |
| STATS ChipPAC Pte. Lte. | 1516 |
6 |
| Siemens AG | 24990 |
5 |
| Other owners | 317 |